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16Kg Tin: SikaBond 5500S Wood Flooring Adhesive **ADR - UN 1133 - CL3 PG II**

SKU: 16-SB-5500S
16Kg Tin: SikaBond 5500S Wood Flooring Adhesive **ADR - UN 1133 - CL3 PG II** SikaBond 5500S is a solvent based rigid adhesive for bonding wood block parquet and engineered boards onto porous substrates. High strength bond, suitable for use with underfloor heating. 1-part, ready to use. High strength rigid bond. Very good spreadability. Excellent adhesion to all types of wood. Adhesive can be sanded.
£116.62 Inc VAT (£97.18 Ex VAT)
Product description: SikaBond-5500 S is a solvent based rigid adhesive for bonding wood block parquet and engineered boards onto porous substrates. High strength bond, suitable for use with underfloor heating. Uses: For full surface bonding of: Traditional parquet blocks and mosaic parquet, industrial parquet and end grained wood paving on cement, anhydrite, and poured asphalt sub-floors. Can be used over underfloor heating installations. Especially suited to wood block refurbishment projects where bitumen adhesive residues are present. Characteristics / advantages: 1-part, ready to use High strength rigid bond Very good spreadability Excellent adhesion to all types of wood Adhesive can be sanded Product information: Chemical base: 1-part synthetic resin combination Packaging: 16kg metal pails Colour: Beige Shelf life: 12 months if stored as outlined, in undamaged original sealed container Storage conditions: Store in dry conditions, and protect from direct sunlight, at temperatures not lower than +5 or higher than +2C Density: 1.53 - 1.58 kg/l Service Temperature: up to 35C Application information: Consumption: For full surface bonding only. Ensure that the contact faces of the wood elements are fully wetted with adhesive. 0.95 1.25 kg/m depending upon size of notched trowel used and subfloor surface profile. For the bonding of long or wide boards or in case of uneven substrates it could be necessary to use a notched trowel with bigger notches (avoid hollow sections). Sag flow: Consistency: Spreads easily, trowel marks stable. Ambient Air Temperature: Room temperature above +10C, ideally 15C. Relative air humidity < 75%. For ambient temperatures the standard construction rules are relevant. Relative Air Humidity: Between 40% and 75% Substrate Temperature: During laying and until SikaBond-5500 S has fully cured substrate temperature must be > + 10C and in the case of underfloor heating < + 20C. For substrate temperatures the standard construction rules are relevant. Substrate Moisture Content: Maximum substrate moisture content : 2.5% CM (carbide meter) for cement screed (ca. 4% Tramex / Gravimetric weight percent) 0.5% CM for anhydrite screed 3 - 12% CM for magnesia flooring (proportion of organic parts) Maximum substrate moisture content in case of underfloor heating: 1.8% CM for cement screed (ca. 3% Tramex / Gravimetric weight percent) 0.3% CM for anhydrite screed 3 - 12% CM for magnesia flooring (proportion of organic parts) For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed. Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2% CM (ca.2.5% Tramex). Curing rate: Floor may be walked on / sanded and finished approximately 48 - 72 hours after installation (depending on climatic conditions, absorbency of subfloor and adhesive layer thickness). Skin time / Laying time: ~ 10 - 20 minutes (+23C / 50% r.h.)

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Brand
  • Sika Everbuild
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